Scale image of the strain sensor with origami-inspired electrode design
Published on August 25th, 2023
Last updated on August 25th, 2023
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- Ming Hsieh Department of Electrical and Computer Engineering
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- Sonny Astani Department of Civil and Environmental Engineering
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- Daniel J. Epstein Department of Industrial and Systems Engineering
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- Technology and Applied Computing Program (TAC)
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ABOUT THE SCHOOL
NEWS | MEDIA | EVENTS
SCHOOL OF
ADVANCED COMPUTING
DEPARTMENTS AND PROGRAMS
- Thomas Lord Department of Computer Science
- Ming Hsieh Department of Electrical and Computer Engineering
- Division of Computing Education (DCE)
- Technology and Applied Computing Program (TAC)
- Interdisciplinary Data Science Program (IDS)
AFFILIATED RESEARCH CENTERS AND INSTITUTES
ADVANCED COMPUTING AFFINITY GROUPS (ACAGs)
DEPARTMENTS AND
ACADEMIC PROGRAMS
- Aerospace and Mechanical Engineering
- Astronautical Engineering
- Alfred E. Mann Department of Biomedical Engineering
- Mork Family Department of Chemical Engineering and Materials Science
- Sonny Astani Department of Civil and Environmental Engineering
- Thomas Lord Department of Computer Science
- Ming Hsieh Department of Electrical and Computer Engineering
- Daniel J. Epstein Department of Industrial and Systems Engineering
- Engineering in Society Program
- Technology and Applied Computing Program (TAC)
EXECUTIVE AND
CONTINUING EDUCATION
ONLINE ACCESS
SPECIALIZED GRADUATE
PROGRAMS
FIRST YEAR APPLICANTS
MASTER'S APPLICANTS
PHD APPLICANTS
TRANSFER APPLICANTS
TECHNOLOGY INNOVATION AND ENTREPRENEURSHIP
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